Deep Reactive Ion Etching (DRIE)
نویسندگان
چکیده
منابع مشابه
Profile Control of a Borosilicate-Glass Groove Formed by Deep Reactive Ion Etching
Deep reactive ion etching (DRIE) of borosilicate glass and profile control of an etched groove are reported. DRIE was carried out using an anodically bonded silicon wafer as an etching mask. We controlled the groove profile, namely improving its sidewall angle, by removing excessively thick polymer film produced by carbonfluoride etching gases during DRIE. Two fabrication processes were experim...
متن کاملStresa, Italy, 25-27 April 2007 PROFILE CONTROL OF A BOROSILICATE-GLASS GROOVE FORMED BY DEEP REACTIVE ION ETCHING
Deep reactive ion etching (DRIE) of borosilicate glass and profile control of an etched groove are reported. DRIE was carried out using an anodically bonded silicon wafer as an etching mask. We controlled the groove profile, namely improving its sidewall angle, by removing excessively thick polymer film produced by carbonfluoride etching gases during DRIE. Two fabrication processes were experim...
متن کاملDesign and implementation of silicon-based optical nanostructures for integrated photonic circuit applications using Deep Reactive Ion Etching (DRIE) technique
In this paper, we present the fabrication of nano optical elements by means of deep reactive ion etching technique (Bosch process) on a silicon-on-insulator substrate. The nano structures are fabricated in a two step process. The first step consists of direct-writing nanoscale patterns on PMMA polymer by electron beam lithography. These nano patterns are then transferred to the silicon surface ...
متن کاملIntegrated Polysilicon and DRIE Bulk Silicon Micromachining for an Electrostatic Torsional Actuator
This paper presents a fabrication process that integrates polysilicon surface micromachining and deep reactive ion etching (DRIE) bulk silicon micromachining. The process takes advantage of the design flexibility of polysilicon surface micromachining and the deep silicon structures possible with DRIE. As a demonstration, a torsional actuator driven by a combdrive moving in the out-of-plane dire...
متن کاملFabrication of micro/nano dual-scale structures by improved deep reactive ion etching
We present an integrated microand nanofabrication method to create micro/nano dual-scale silicon structures with a controllable sidewall profile over an entire 4 inch wafer. The fabrication is based on an improved Bosch deep reactive ion etching (DRIE) process and its black silicon effect, in which SF6 and C4F8 gases are used as the reactants of etching and passivation, respectively. The result...
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تاریخ انتشار 2004